Intel chip assembly and test factory in Chengdu, the 480 million first chip off the assembly line today, and formally put into production by 2010 Mobile Intel Duo Core. Studio 1537 battery , Studio 1555 battery
Intel’s announcement that Intel’s Chengdu Factory is now the world’s largest chip packaging and testing centers, the second half of 2010 will be included in one of the silicon wafer in the world treatment of these three plants. Chengdu assembly plant will be largest in the world and test the incoming supply base.
Wafer pre-treatment is a process for manufacturing integrated circuits in semiconductor wafer fabrication and packaging, an intermediary between tests, a series of processes for wafer polishing, partition, and prepare the process conditioning. All Pre-filled wafers will be transported to Chengdu, including Intel, the world, including more than packaging and testing plant. Intel is currently in the United States and Israel have both pre-wafer processing plants.
Data from Intel, said today, Intel Chengdu plant employs nearly 3,000, and will soon be expanded to 3,500 people.
In August 2003, then CEO of Intel, Craig Barrett, Mr. eighth visit to China, announced the investment and construction of the packaging of chips from Intel and testing in Chengdu. Plant investment 375 million U.S. dollars, and in 2004 construction. In March 2005, Intel announced the recovery of the plant construction of two projects, total investment amounted to 525 million U.S. dollars. inspiron 640m battery
In 2009, Intel Chengdu plant a third to an investment of 75 million U.S. dollars to expand its production capacity, allowing the total investment of Intel in Chengdu to reach 600 million U.S. dollars.
In 2009, exports of Intel and the assembly plant test in Chengdu, Chengdu and EPZs year, representing over 80% of total exports, with exports of traffic development in Sichuan Province, sony vgp-bps2 , over 30%.